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Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
SST32HF16x2x / 32x2x / 6482x16/32/64Mb Flash + 4/8Mb SRAM, 32Mb Flash + 8Mb SRAM (x16) MCP ComboMemories
Preliminary Specifications
FEATURES:
* ComboMemories organized as: - SST32HF1622C: 1M x16 Flash + 128K x16 SRAM - SST32HF1642x: 1M x16 Flash + 256K x16 SRAM - SST32HF1682: 1M x16 Flash + 512K x16 SRAM - SST32HF3242x: 2M x16 Flash + 256K x16 SRAM - SST32HF3282: 2M x16 Flash + 512K x16 SRAM * Single 2.7-3.3V Read and Write Operations * Concurrent Operation - Read from or Write to SRAM while Erase/Program Flash * Superior Reliability - Endurance: 100,000 Cycles (typical) - Greater than 100 years Data Retention * Low Power Consumption: - Active Current: 15 mA (typical) for Flash or SRAM Read - Standby Current: - SST32HFx2: 60 A (typical) - SST32HFx2C: 12 A (typical) * Flexible Erase Capability - Uniform 2 KWord sectors - Uniform 32 KWord size blocks * Erase-Suspend/Erase-Resume Capabilities * Security-ID Feature - SST: 128 bits; User: 128 bits * Hardware Block-Protection/WP# Input Pin - Top Block-Protection (top 32 KWord) * Fast Read Access Times: - Flash: 70 ns - SRAM: 70 ns * Latched Address and Data for Flash * Flash Fast Erase and Word-Program: - Sector-Erase Time: 18 ms (typical) - Block-Erase Time: 18 ms (typical) - Chip-Erase Time: 40 ms (typical) - Word-Program Time: 7 s (typical) * Flash Automatic Erase and Program Timing - Internal VPP Generation * Flash End-of-Write Detection - Toggle Bit - Data# Polling * CMOS I/O Compatibility * JEDEC Standard Command Set * Package Available - 63-ball LFBGA (8mm x 10mm x 1.4mm) - 62-ball LFBGA (8mm x 10mm x 1.4mm) * All non-Pb (lead-free) devices are RoHS compliant
PRODUCT DESCRIPTION
The SST32HFx2/x2C ComboMemory devices integrate a CMOS flash memory bank with a CMOS SRAM memory bank in a Multi-Chip Package (MCP), manufactured with SST's proprietary, high performance SuperFlash technology. The SST32HF16x2/32x2 devices use a PseudoSRAM. The SST32HF16x2C/3242C devices use standard SRAM. Featuring high performance Word-Program, the flash memory bank provides a maximum Word-Program time of 7 sec. To protect against inadvertent flash write, the SST32HFx2/x2C devices contain on-chip hardware and software data protection schemes. The SST32HFx2/x2C devices offer a guaranteed endurance of 10,000 cycles. Data retention is rated at greater than 100 years. The SST32HFx2/x2C devices consist of two independent memory banks with respective bank enable signals. The Flash and SRAM memory banks are superimposed in the same memory address space. Both memory banks share common address lines, data lines, WE# and OE#. The memory bank selection is done by memory bank enable
(c)2005 Silicon Storage Technology, Inc. S71253-03-000 5/05 1
signals. The SRAM bank enable signal, BES# selects the SRAM bank. The flash memory bank enable signal, BEF# selects the flash memory bank. The WE# signal has to be used with Software Data Protection (SDP) command sequence when controlling the Erase and Program operations in the flash memory bank. The SDP command sequence protects the data stored in the flash memory bank from accidental alteration. The SST32HFx2/x2C provide the added functionality of being able to simultaneously read from or write to the SRAM bank while erasing or programming in the flash memory bank. The SRAM memory bank can be read or written while the flash memory bank performs SectorErase, Bank-Erase, or Word-Program concurrently. All flash memory Erase and Program operations will automatically latch the input address and data signals and complete the operation in background without further input stimulus requirement. Once the internally controlled Erase or Program cycle in the flash bank has commenced, the SRAM bank can be accessed for Read or Write.
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc. MPF+ and ComboMemory are trademarks of Silicon Storage Technology, Inc. These specifications are subject to change without notice.
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications The SST32HFx2/x2C devices are suited for applications that use both flash memory and (P)SRAM memory to store code or data. For systems requiring low power and small form factor, the SST32HFx2/x2C devices significantly improve performance and reliability while lowering power consumption when compared with multiple chip solutions. The SST32HFx2/x2C inherently use less energy during Erase and Program operations than alternative flash technologies. The total energy consumed is a function of the applied voltage, current, and time of application. Since, for any given voltage range, SuperFlash technology uses less current to program and has a shorter erase time, the total energy consumed during any Erase or Program operation is less than alternative flash technologies. SuperFlash technology provides fixed Erase and Program times independent of the number of Erase/Program cycles that have occurred. Therefore the system software or hardware does not have to be modified or de-rated as is necessary with alternative flash technologies, whose Erase and Program times increase with accumulated Erase/Program cycles.
Concurrent Read/Write Operation
The SST32HFx2/x2C provide the unique benefit of being able to read from or write to SRAM, while simultaneously erasing or programming the flash. This allows data alteration code to be executed from SRAM, while altering the data in flash. See Figure 26 for a flowchart. The following table lists all valid states. CONCURRENT READ/WRITE STATE TABLE
Flash Program/Erase Program/Erase SRAM Read Write
The device will ignore all SDP commands when an Erase or Program operation is in progress. Note that Product Identification commands use SDP; therefore, these commands will also be ignored while an Erase or Program operation is in progress.
Flash Read Operation
The Read operation of the SST32HFx2/x2C devices is controlled by BEF# and OE#. Both have to be low, with WE# high, for the system to obtain data from the outputs. BEF# is used for flash memory bank selection. When BEF# is high, the chip is deselected and only standby power is consumed. OE# is the output control and is used to gate data from the output pins. The data bus is in high impedance state when OE# is high. Refer to Figure 6 for further details.
Device Operation
The SST32HFx2/x2C use BES1#, BES2 and BEF# to control operation of either the flash or the SRAM memory bank. When BEF# is low, the flash bank is activated for Read, Program or Erase operation. When BES1# is low, and BES2 is high the SRAM is activated for Read and Write operation. BEF# and BES1# cannot be at low level, and BES2 cannot be at high level at the same time. If all bank enable signals are asserted, bus contention will result and the device may suffer permanent damage. All address, data, and control lines are shared by flash and SRAM memory banks which minimizes power consumption and loading. The device goes into standby when BEF# and BES1# bank enables are raised to VIHC (Logic High) or when BEF# is high and BES2 is low.
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
2
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
Flash Word-Program Operation
The flash memory bank of the SST32HFx2/x2C devices is programmed on a word-by-word basis. Before Program operations, the memory must be erased first. The Program operation consists of three steps. The first step is the threebyte load sequence for Software Data Protection. The second step is to load word address and word data. During the Word-Program operation, the addresses are latched on the falling edge of either BEF# or WE#, whichever occurs last. The data is latched on the rising edge of either BEF# or WE#, whichever occurs last. The third step is the internal Program operation which is initiated after the rising edge of the fourth WE# or BEF#, whichever occurs first. The Program operation, once initiated, will be completed, within 10 s. See Figures 7 and 8 for WE# and BEF# controlled Program operation timing diagrams and Figure 21 for flowcharts. During the Program operation, the only valid flash Read operations are Data# Polling and Toggle Bit. During the internal Program operation, the host is free to perform additional tasks. During the command sequence, WP# should be statically held high or low. Any SDP commands loaded during the internal Program operation will be ignored.
Erase-Suspend/Erase-Resume Commands
The Erase-Suspend operation temporarily suspends a Sector- or Block-Erase operation thus allowing data to be read from any memory location, or program data into any sector/block that is not suspended for an Erase operation. The operation is executed by issuing one byte command sequence with Erase-Suspend command (B0H). The device automatically enters read mode typically within 20 s after the Erase-Suspend command had been issued. Valid data can be read from any sector or block that is not suspended from an Erase operation. Reading at address location within erase-suspended sectors/blocks will output DQ2 toggling and DQ6 at "1". While in Erase-Suspend mode, a Word-Program operation is allowed except for the sector or block selected for Erase-Suspend. To resume Sector-Erase or Block-Erase operation which has been suspended the system must issue Erase Resume command. The operation is executed by issuing one byte command sequence with Erase Resume command (30H) at any address in the last Byte sequence.
Flash Chip-Erase Operation
The SST32HFx2/x2C provide a Chip-Erase operation, which allows the user to erase the entire memory array to the "1" state. This is useful when the entire device must be quickly erased. The Chip-Erase operation is initiated by executing a sixbyte command sequence with Chip-Erase command (10H) at address 5555H in the last byte sequence. The Erase operation begins with the rising edge of the sixth WE# or BEF#, whichever occurs first. During the Erase operation, the only valid read is Toggle Bit or Data# Polling. See Table 6 for the command sequence, Figure 10 for timing diagram, and Figure 25 for the flowchart. Any commands issued during the Chip-Erase operation are ignored.
Flash Sector/Block-Erase Operation
The Flash Sector/Block-Erase operation allows the system to erase the device on a sector-by-sector (or block-byblock) basis. The SST32HFx2/x2C offer both Sector-Erase and Block-Erase mode. The sector architecture is based on uniform sector size of 2 KWord. The Block-Erase mode is based on uniform block size of 32 KWord. The SectorErase operation is initiated by executing a six-byte command sequence with Sector-Erase command (30H) and sector address (SA) in the last bus cycle. The address lines AMS-A11 are used to determine the sector address. The Block-Erase operation is initiated by executing a six-byte command sequence with Block-Erase command (50H) and block address (BA) in the last bus cycle. The address lines AMS-A15 are used to determine the block address. The sector or block address is latched on the falling edge of the sixth WE# pulse, while the command (30H or 50H) is latched on the rising edge of the sixth WE# pulse. The internal Erase operation begins after the sixth WE# pulse. The End-of-Erase operation can be determined using either Data# Polling or Toggle Bit methods. See Figures 12 and 13 for timing waveforms. Any commands issued during the Sector- or Block-Erase operation are ignored, WP# should be statically held high or low.
Write Operation Status Detection
The SST32HFx2/x2C provide two software means to detect the completion of a write (Program or Erase) cycle, in order to optimize the system Write cycle time. The software detection includes two status bits: Data# Polling (DQ7) and Toggle Bit (DQ6). The End-of-Write detection mode is enabled after the rising edge of WE#, which initiates the internal Program or Erase operation.
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
3
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications The actual completion of the nonvolatile write is asynchronous with the system; therefore, either a Data# Polling or Toggle Bit read may be simultaneous with the completion of the Write cycle. If this occurs, the system may possibly get an erroneous result, i.e., valid data may appear to conflict with either DQ7 or DQ6. In order to prevent spurious rejection, if an erroneous result occurs, the software routine should include a loop to read the accessed location an additional two (2) times. If both reads are valid, then the device has completed the Write cycle, otherwise the rejection is valid. TABLE 1: WRITE OPERATION STATUS
Status
Normal Standard Operation Program Standard Erase EraseSuspend Mode Read from Erase-Suspended Sector/Block Read from Non- Erase-Suspended Sector/Block Program
DQ7
DQ7# 0 1
DQ6
Toggle Toggle 1
DQ2
No Toggle Toggle Toggle
Data
Data
Data
DQ7#
Toggle
N/A
T1.0 1253
Flash Data# Polling (DQ7)
When the SST32HFx2/x2C flash memory banks are in the internal Program operation, any attempt to read DQ7 will produce the complement of the true data. Once the Program operation is completed, DQ7 will produce true data. Note that even though DQ7 may have valid data immediately following the completion of an internal Write operation, the remaining data outputs may still be invalid: valid data on the entire data bus will appear in subsequent successive Read cycles after an interval of 1 s. During internal Erase operation, any attempt to read DQ7 will produce a `0'. Once the internal Erase operation is completed, DQ7 will produce a `1'. The Data# Polling is valid after the rising edge of the fourth WE# (or BEF#) pulse for Program operation. For Sector- or Block-Erase, the Data# Polling is valid after the rising edge of the sixth WE# (or BEF#) pulse. See Figure 9 for Data# Polling timing diagram and Figure 22 for a flowchart.
Note: DQ7 and DQ2 require a valid address when reading status information.
Flash Memory Data Protection
The SST32HFx2/x2C flash memory bank provides both hardware and software features to protect nonvolatile data from inadvertent writes.
Flash Hardware Data Protection
Noise/Glitch Protection: A WE# or BEF# pulse of less than 5 ns will not initiate a Write cycle. VDD Power Up/Down Detection: The Write operation is inhibited when VDD is less than 1.5V. Write Inhibit Mode: Forcing OE# low, BEF# high, or WE# high will inhibit the flash Write operation. This prevents inadvertent writes during power-up or power-down.
Toggle Bits (DQ6 and DQ2)
During the internal Program or Erase operation, any consecutive attempts to read DQ6 will produce alternating "1"s and "0"s, i.e., toggling between 1 and 0. When the internal Program or Erase operation is completed, the DQ6 bit will stop toggling. The device is then ready for the next operation. For Sector-, Block-, or Chip-Erase, the toggle bit (DQ6) is valid after the rising edge of sixth WE# (or BEF#) pulse. DQ6 will be set to "1" if a Read operation is attempted on an Erase-Suspended Sector/Block. If Program operation is initiated in a sector/block not selected in Erase-Suspend mode, DQ6 will toggle. An additional Toggle Bit is available on DQ2, which can be used in conjunction with DQ6 to check whether a particular sector is being actively erased or erase-suspended. Table 1 shows detailed status bits information. The Toggle Bit (DQ2) is valid after the rising edge of the last WE# (or BEF#) pulse of Write operation. See Figure 10 for Toggle Bit timing diagram and Figure 22 for a flowchart.
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
4
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
Hardware Block Protection
The SST32HFx2/x2C support top hardware block protection, which protects the top 32 KWord block of the device. The Boot Block address ranges are described in Table 2. Program and Erase operations are prevented on the 32 KWord when WP# is low. If WP# is left floating, it is internally held high via a pull-up resistor, and the Boot Block is unprotected, enabling Program and Erase operations on that block. TABLE 2: BOOT BLOCK ADDRESS RANGES
Product Top Boot Block SST32HF16x2x SST32HF32x2x 0F8000H-0FFFFFH 1F8000H-1FFFFFH
T2.1 1253
SRAM Read
The SRAM Read operation of the SST32HFx2/x2C is controlled by OE# and BES1#, both have to be low with WE# and BES2 high for the system to obtain data from the outputs. BES1# and BES2 are used for SRAM bank selection. OE# is the output control and is used to gate data from the output pins. The data bus is in high impedance state when OE# is high. Refer to the Read cycle timing diagram, Figure 3, for further details.
SRAM Write
The SRAM Write operation of the SST32HFx2/x2C is controlled by WE# and BES1#, both have to be low, BES2 must be high for the system to write to the SRAM. During the Word-Write operation, the addresses and data are referenced to the rising edge of either BES1#, WE#, or the falling edge of BES2 whichever occurs first. The write time is measured from the last falling edge of BES#1 or WE# or the rising edge of BES2 to the first rising edge of BES1#, or WE# or the falling edge of BES2. Refer to the Write cycle timing diagrams, Figures 4 and 5, for further details.
Address Range
Hardware Reset (RST#)
The RST# pin provides a hardware method of resetting the device to read array data. When the RST# pin is held low for at least TRP, any in-progress operation will terminate and return to Read mode. When no internal Program/Erase operation is in progress, a minimum period of TRHR is required after RST# is driven high before a valid Read can take place (see Figure 17). The Erase or Program operation that has been interrupted needs to be reinitiated after the device resumes normal operation mode to ensure data integrity.
Product Identification
The Product Identification mode identifies the devices as the SST32HFx2/x2C and manufacturer as SST. This mode may be accessed by software operations only. The hardware device ID Read operation, which is typically used by programmers, cannot be used on this device because of the shared lines between flash and SRAM in the multi-chip package. Therefore, application of high voltage to pin A9 may damage this device. Users may use the software Product Identification operation to identify the part (i.e., using the device ID) when using multiple manufacturers in the same socket. For details, see Tables 5 and 6 for software operation, Figure 14 for the software ID entry and read timing diagram and Figure 23 for the ID entry command sequence flowchart. TABLE 3: PRODUCT IDENTIFICATION
Address Manufacturer's ID Device ID SST32HF16x2x SST32HF32x2x 0001H 0001H 234AH 235AH
T3.2 1253
Flash Software Data Protection (SDP)
The SST32HFx2/x2C provide the JEDEC approved software data protection scheme for all flash memory bank data alteration operations, i.e., Program and Erase. Any Program operation requires the inclusion of a series of three-byte sequence. The three byte-load sequence is used to initiate the Program operation, providing optimal protection from inadvertent Write operations, e.g., during the system power-up or power-down. Any Erase operation requires the inclusion of six-byte load sequence. The SST32HFx2/x2C devices are shipped with the software data protection permanently enabled. See Table 6 for the specific software command codes. During SDP command sequence, invalid commands will abort the device to Read mode, within TRC. The contents of DQ15-DQ8 can be VIL or VIH, but no other value, during any SDP command sequence.
Data BFH
0000H
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
5
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
Product Identification Mode Exit/Reset
In order to return to the standard read mode, the Software Product Identification mode must be exited. Exiting is accomplished by issuing the Exit ID command sequence, which returns the device to the Read operation. Please note that the software reset command is ignored during an internal Program or Erase operation. This command may also be used to reset the device to Read mode after any inadvertent transient condition that apparently causes the device to behave abnormally, e.g. not read correctly. See Table 6 for software command codes, Figure 15 for timing waveform and Figure 23 for a flowchart.
To program the user segment of the Security ID, the user must use the Security ID Word-Program command. To detect end-of-write for the SEC ID, read the toggle bits. Do not use Data# Polling. Once this is complete, the Sec ID should be locked using the User Sec ID Program Lock-Out. This disables any future corruption of this space. Note that regardless of whether or not the Sec ID is locked, neither Sec ID segment can be erased. The Secure ID space can be queried by executing a threebyte command sequence with Enter Sec ID command (88H) at address 5555H in the last byte sequence. To exit this mode, the Exit Sec ID command should be executed. Refer to Table 6 for more details.
Security ID
The SST32HFx2/x2C devices offer a 256-bit Security ID space. The Secure ID space is divided into two 128-bit segments - one factory programmed segment and one user programmed segment. The first segment is programmed and locked at SST with a random 128-bit number. The user segment is left un-programmed for the customer to program as desired.
Design Considerations
SST recommends a high frequency 0.1 F ceramic capacitor to be placed as close as possible between VDD and VSS, e.g., less than 1 cm away from the VDD pin of the device. Additionally, a low frequency 4.7 F electrolytic capacitor from VDD to VSS should be placed within 1 cm of the VDD pin.
FUNCTIONAL BLOCK DIAGRAM
Address Buffers
SRAM/ PSRAM
UBS# LBS# BES1# BES2 BEF# OE1# WE1# WP# RESET#
Control Logic I/O Buffers
AMS-A0
DQ15 - DQ8 DQ7 - DQ0
Address Buffers & Latches
SuperFlash Memory
1253 B1.1
Notes: 1. For LS package only:
WE# = WEF# and/or WES# OE# = OEF# and/or OES#
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
6
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
TOP VIEW (balls facing down) SST32HF16x2x/32x2x
8
NC A20 A16 A11 A8 A15 A10 A14 A9 A13
7 6
WEF# NC
A12 VSSF NC
NC
DQ15 WES# DQ14 DQ7 DQ13 DQ6 DQ4 DQ5 DQ12 BES2 VDDS VDDF
5 4 3
LBS# UBS# OES# DQ9 DQ8 DQ0 DQ1 A6 A0 A3 A2 A1 BES1# NC VSSS RST# WP# NC A19 DQ11 DQ10 DQ2 DQ3
1253 62-tfbga P1.1 1253 63-tfbga P2.0
2 1
NC
A18 NC
A17 A5
A7 A4
BEF# VSSF OEF# NC
ABCDEFGHJK
FIGURE 1: PIN ASSIGNMENTS FOR 62-BALL LFBGA (8MM X 10MM)
TOP VIEW (balls facing down)
8 7 6
A8 A19 A9 A10 DQ6 DQ13 DQ12 DQ5 DQ4 VDDS NC DQ3 VDDF DQ11 A17 A4 A1 DQ1 DQ9 DQ10 DQ2 VSS OE# DQ0 DQ8 A0 BEF# BES1# NC NC NC NC A11 A15 A12 A21 A13 NC A14 A16 NC VSS NC NC DQ15 DQ7 DQ14 NC
5
WE# BES2 A20
4
WP# RST# NC
3
LBS# UBS# A18
2
A7 A6 A3 A5 A2
1
NC
ABCDEFGHJK
FIGURE 2: PIN ASSIGNMENTS FOR 63-BALL LFBGA (8MM X 10MM)
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
7
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications TABLE 4: PIN DESCRIPTION
Symbol Pin Name Functions To provide flash address, AMS-A0. To provide SRAM address, AMS-A0 To output data during Read cycles and receive input data during Write cycles. Data is internally latched during a flash Erase/Program cycle. The outputs are in tri-state when OE# is high or BES1# is high or BES2 is low and BEF# is high. To activate the Flash memory bank when BEF# is low AMS1 to A0 Address Inputs DQ15-DQ0 Data Inputs/Outputs
BEF# BES1# BES2 OEF#2 OES#2 WEF#2 WES#2 OE# WE# UBS# LBS# WP# RST# VSSF2 VSSS2 VSS
Flash Memory Bank Enable
SRAM Memory Bank Enable To activate the SRAM memory bank when BES1# is low SRAM Memory Bank Enable To activate the SRAM memory bank when BES2 is high Output Enable Output Enable Write Enable Write Enable Output Enable Write Enable Upper Byte Control (SRAM) Lower Byte Control (SRAM) Write Protect Reset Ground Ground Ground Power Supply (Flash) Power Supply (SRAM) No Connection 2.7-3.3V Power Supply to Flash only 2.7-3.3V Power Supply to SRAM only Unconnected pins
T4.2 1253
To gate the data output buffers for Flash2 only To gate the data output buffers for SRAM2 only To control the Write operations for Flash2 only To control the Write operations for SRAM2 only To gate the data output buffers To control the Write operations To enable DQ15-DQ8 To enable DQ7-DQ0 To protect and unprotect sectors from Erase or Program operation To Reset and return the device to Read mode Flash2 only SRAM2 only
VDDF VDDS
NC
1. AMS = Most Significant Address AMS = A19 for SST32HF16x2x and A20 for SST32HF32x2x 2. LS package only
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
8
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications TABLE 5: OPERATIONAL MODES SELECTION1
Mode Full Standby Output Disable BEF# VIH VIH VIL Flash Read Flash Write Flash Erase SRAM Read VIL VIL VIL VIH BES1# VIH X VIL VIL VIH X VIH X VIH X VIH X VIL BES22 X VIL VIH VIH X VIL X VIL X VIL X VIL VIH VIL VIH VIL VIH VIL SRAM Write VIH VIL VIH X VIL VIL VIH VIL Product Identification4 VIL VIH X X VIL VIL VIH X VIL VIL VIH VIL VIL VIH X DOUT HIGH-Z DOUT DIN HIGH-Z DIN DOUT DOUT HIGH-Z DIN DIN HIGH-Z VIH VIL X X X X VIH VIL X X DIN DIN VIL VIH X X DOUT DOUT OE#3 X X VIH X VIH WE#3 X X VIH X VIH LBS# X X X VIH X UBS# X X X VIH X HIGH-Z HIGH-Z HIGH-Z HIGH-Z DQ0-7 HIGH-Z DQ8-15 HIGH-Z
Manufacturer's ID5 Device ID5
T5.2 1253
1. X can be VIL or VIH, but no other value. 2. Do not apply BEF# = VIL, BES1# = VIL and BES2 = VIH at the same time 3. OE# = OEF# and OES# WE# = WEF# and WES# for LS package only 4. Software mode only 5. With AMS-A1 = 0;SST Manufacturer's ID = 00BFH, is read with A0=0, SST32HF16x2x Device ID = 234AH, is read with A0=1, SST32HF32x2x Device ID = 235AH, is read with A0=1.
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
9
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications TABLE 6: SOFTWARE COMMAND SEQUENCE
Command Sequence
Word-Program Sector-Erase Block-Erase Chip-Erase Erase-Suspend Erase-Resume Query Sec ID5
1st Bus Write Cycle Addr1 5555H 5555H 5555H 5555H XXXXH XXXXH 5555H 5555H 5555H 5555H 5555H XXH Data2 AAH AAH AAH AAH B0H 30H AAH AAH AAH AAH AAH F0H
2nd Bus Write Cycle Addr1 2AAAH 2AAAH 2AAAH 2AAAH Data2 55H 55H 55H 55H
3rd Bus Write Cycle Addr1 5555H 5555H 5555H 5555H Data2 A0H 80H 80H 80H
4th Bus Write Cycle Addr1 WA3 5555H 5555H 5555H Data2 Data AAH AAH AAH
5th Bus Write Cycle Addr1 2AAAH 2AAAH 2AAAH Data2 55H 55H 55H
6th Bus Write Cycle Addr1 SAX4 BAX
4
Data2 30H 50H 10H
5555H
2AAAH 2AAAH 2AAAH 2AAAH 2AAAH
55H 55H 55H 55H 55H
5555H 5555H 5555H 5555H 5555H
88H A5H 85H 90H F0H WA6 XXH6 Data 0000H
User Security ID Word-Program User Security ID Program Lock-Out Software ID Entry7,8 Software ID /Sec ID Exit Exit9,10
Software ID Exit9,10 /Sec ID Exit
T6.2 1253
1. Address format A14-A0 (Hex). Addresses A15-A19 can be VIL or VIH, but no other value, for Command sequence for SST32HF16x2x, Addresses A15-A20 can be VIL or VIH, but no other value, for Command sequence for SST32HF32x2x. 2. DQ15-DQ8 can be VIL or VIH, but no other value, for Command sequence 3. WA = Program Word address 4. SAX for Sector-Erase; uses AMS-A11 address lines BAX, for Block-Erase; uses AMS-A15 address lines AMS = Most significant address AMS = A19 for SST32HF16x2x and A20 for SST32HF32x2x. 5. With AMS-A4 = 0; Sec ID is read with A3-A0, SST ID is read with A3 = 0 (Address range = 000000H to 000007H), User ID is read with A3 = 1 (Address range = 000010H to 000017H). Lock Status is read with A7-A0 = 0000FFH. Unlocked: DQ3 = 1 / Locked: DQ3 = 0. 6. Valid Word-Addresses for Sec ID are from 000000H-000007H and 000010H-000017H. 7. The device does not remain in Software Product ID Mode if powered down. 8. With AMS-A1 =0; SST Manufacturer ID = 00BFH, is read with A0 = 0, SST32HF16x2x Device ID = 234AH, is read with A0 = 1, SST32HF32x2x Device ID = 235AH, is read with A0 = 1, AMS = Most significant address AMS = A19 for SST32HF16x2x and A20 for SST32HF32x2x. 9. Both Software ID Exit operations are equivalent 10. If users never lock after programming, Sec ID can be programmed over the previously unprogrammed bits (data=1) using the Sec ID mode again (the programmed "0" bits cannot be reversed to "1"). Valid Word-Addresses for Sec ID are from 000000H-000007H and 000010H-000017H.
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
10
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications Absolute Maximum Stress Ratings (Applied conditions greater than those listed under "Absolute Maximum Stress Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.) Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -20C to +85C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to +150C D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD1+0.3V Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to VDD1+1.0V Package Power Dissipation Capability (TA = 25C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W Surface Mount Solder Reflow Temperature2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C for 10 seconds Output Short Circuit Current3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
1. VDD = VDDF and VDDS 2. Excluding certain with-Pb 32-PLCC units, all packages are 260C capable in both non-Pb and with-Pb solder versions. Certain with-Pb 32-PLCC package types are capable of 240C for 10 seconds; please consult the factory for the latest information. 3. Outputs shorted for no more than one second. No more than one output shorted at a time.
OPERATING RANGE
Range Commercial Extended Ambient Temp 0C to +70C -20C to +85C VDD 2.7-3.3V 2.7-3.3V
AC CONDITIONS OF TEST
Input Rise/Fall Time . . . . . . . . . . . . . . 5 ns Output Load . . . . . . . . . . . . . . . . . . . . CL = 30 pF See Figures 19 and 20
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
11
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications TABLE 7: DC OPERATING CHARACTERISTICS (VDD = VDDF AND VDDS = 2.7-3.3V)
Limits Symbol IDD Parameter Active VDD Current Read Flash SRAM Concurrent Operation Write1 Flash SRAM ISB IRT ILI ILO VIL VILC VIH VIHC VOLF VOHF VOLS VOHS Standby VDD Current SST32HFx2 SST32HFx2C Reset VDD Current Input Leakage Current Output Leakage Current Input Low Voltage Input Low Voltage (CMOS) Input High Voltage Input High Voltage (CMOS) Flash Output Low Voltage Flash Output High Voltage SRAM Output Low Voltage SRAM Output High Voltage 2.2 0.7 VDD VDD-0.3 0.2 35 30 110 30 30 1 10 0.8 0.3 mA mA A A A A A V V V V V V 0.4 V V 18 30 40 mA mA mA Min Max Units Test Conditions Address input = VILT/VIHT, at f=5 MHz, VDD=VDD Max, all DQs open OE#=VIL, WE#=VIH BEF#=VIL, BES1#=VIH, or BES2=VIL BEF#=VIH, BES1#=VIL , BES2=VIH BEF#=VIH, BES1#=VIL , BES2=VIH WE#=VIL BEF#=VIL, BES1#=VIH, or BES2=VIL, OE#=VIH BEF#=VIH, BES1#=VIL , BES2=VIH VDD = VDD Max, BEF#=BES1#=VIHC, BES2=VILC Reset=VSS0.3V VIN=GND to VDD, VDD=VDD Max VOUT=GND to VDD, VDD=VDD Max VDD=VDD Min VDD=VDD Max VDD=VDD Max VDD=VDD Max IOL=100 A, VDD=VDD Min IOH=-100 A, VDD=VDD Min IOL =1 mA, VDD=VDD Min IOH =-500 A, VDD=VDD Min
T7.1 1253
VDD-0.2
1. IDD active while Erase or Program is in progress.
TABLE 8: RECOMMENDED SYSTEM POWER-UP TIMINGS
Symbol TPU-READ
1
Parameter Power-up to Read Operation Power-up to Program/Erase Operation
Minimum 100 100
Units s s
T8.0 1253
TPU-WRITE1
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
TABLE 9: CAPACITANCE (TA = 25C, f=1 Mhz, other pins open)
Parameter CI/O
1
Description I/O Pin Capacitance Input Capacitance
Test Condition VI/O = 0V VIN = 0V
Maximum 12 pF 12 pF
T9.0 1253
CIN1
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
TABLE 10: FLASH RELIABILITY CHARACTERISTICS
Symbol NEND1 TDR
1
Parameter Endurance Data Retention Latch Up
Minimum Specification 10,000 100 100 + IDD
Units Cycles Years mA
Test Method JEDEC Standard A117 JEDEC Standard A103 JEDEC Standard 78
T10.0 1253
ILTH1
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
(c)2005 Silicon Storage Technology, Inc. S71253-03-000 5/05
12
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
AC CHARACTERISTICS
TABLE 11: SRAM READ CYCLE TIMING PARAMETERS
Symbol TRCS TAAS TBES TOES TBYES TBLZS1 TOLZS1 TBYLZS1 TBHZS1 TOHZS1 TBYHZS1 TOHS Parameter Read Cycle Time Address Access Time Bank Enable Access Time Output Enable Access Time UBS#, LBS# Access Time BES# to Active Output Output Enable to Active Output UBS#, LBS# to Active Output BES# to High-Z Output Output Disable to High-Z Output UBS#, LBS# to High-Z Output Output Hold from Address Change 10 0 0 0 0 25 25 35 Min 70 70 70 35 70 Max Units ns ns ns ns ns ns ns ns ns ns ns ns
T11.1 1253
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
TABLE 12: SRAM WRITE CYCLE TIMING PARAMETERS
Symbol TWCS TBWS TAWS TASTS TWPS TWRS TBYWS TODWS TOEWS TDSS TDHS Parameter Write Cycle Time Bank Enable to End-of-Write Address Valid to End-of-Write Address Set-up Time Write Pulse Width Write Recovery Time UBS#, LBS# to End-of-Write Output Disable from WE# Low Output Enable from WE# High Data Set-up Time Data Hold from Write Time 0 30 0 Min 70 60 60 0 60 0 60 30 Max Units ns ns ns ns ns ns ns ns ns ns ns
T12.1 1253
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
13
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications TABLE 13: FLASH READ CYCLE TIMING PARAMETERS VDD = 2.7-3.6V
Symbol TRC TCE TAA TOE TCLZ1 TOLZ1 TCHZ1 TOHZ1 TOH1 TRP1 TRHR1 TRY1,2 Parameter Read Cycle Time Chip Enable Access Time Address Access Time Output Enable Access Time BEF# Low to Active Output OE# Low to Active Output BEF# High to High-Z Output OE# High to High-Z Output Output Hold from Address Change RST# Pulse Width RST# High before Read RST# Pin Low to Read Mode 0 500 50 20 0 0 20 20 Min 70 70 70 35 Max Units ns ns ns ns ns ns ns ns ns ns ns s
T13.1 1253
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter. 2. This parameter applies to Sector-Erase, Block-Erase and Program operations. This parameter does not apply to Chip-Erase operations.
TABLE 14: FLASH PROGRAM/ERASE CYCLE TIMING PARAMETERS
Symbol TBP TAS TAH TCS TCH TOES TOEH TCP TWP TWPH1 TCPH1 TDS TDH1 TIDA1 TSE TBE TSCE Parameter Word-Program Time Address Setup Time Address Hold Time WE# and BEF# Setup Time WE# and BEF# Hold Time OE# High Setup Time OE# High Hold Time BEF# Pulse Width WE# Pulse Width WE# Pulse Width High BEF# Pulse Width High Data Setup Time Data Hold Time Software ID Access and Exit Time Sector-Erase Block-Erase Chip-Erase 0 30 0 0 0 10 40 40 30 30 30 0 150 25 25 50 Min Max 10 Units s ns ns ns ns ns ns ns ns ns ns ns ns ns ms ms ms
T14.0 1253
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
14
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
TRCS ADDRESSES AMSS-0 TAAS BES1# TBES TOHS
BES2
TBES TBLZS TBHZS TOES TOLZS TOHZS TBYES TBYLZS TBYHZS DATA VALID
1253 F03.0
OE#
UBS#, LBS#
DQ15-0
Note: AMSS = Most Significant SRAM Address AMSS = A16 for SST32HF1622C, A17 for SST32HFxx42x, and A18 for SST32HFxx82
FIGURE 3: SRAM READ CYCLE TIMING DIAGRAM
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
15
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
TWCS ADDRESSES AMSS3-0 TASTS TWPS TWRS
WE# TAWS TBWS BES1#
BES2
TBWS
TBYWS UBS#, LBS# TODWS TOEWS TDSS TDHS NOTE 2
1253 F04.0
DQ15-8, DQ7-0
NOTE 2
VALID DATA IN
Note: 1. If OE# is High during the Write cycle, the outputs will remain at high impedance. 2. If BES1# goes Low or BES2 goes high coincident with or after WE# goes Low, the output will remain at high impedance. If BES1# goes High or BES2 goes low coincident with or before WE# goes High, the output will remain at high impedance. Because DIN signals may be in the output state at this time, input signals of reverse polarity must not be applied. 3. AMSS = Most Significant SRAM Address AMSS = A16 for SST32HF1622C, A17 for SST32HFxx42x, and A18 for SST32HFxx82
FIGURE 4: SRAM WRITE CYCLE TIMING DIAGRAM (WE# CONTROLLED)1
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
16
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
TWCS ADDRESSES AMSS3-0 TWPS WE# TWRS
TBWS BES1#
BES2
TBWS TAWS TASTS TBYWS
UBS#, LBS# TDSS DQ15-8, DQ7-0 TDHS
NOTE 2
VALID DATA IN
NOTE 2
1253 F05.0
Note: 1. If OE# is High during the Write cycle, the outputs will remain at high impedance. 2. Because DIN signals may be in the output state at this time, input signals of reverse polarity must not be applied. 3. AMSS = Most Significant SRAM Address AMSS = A16 for SST32HF1622C, A17 for SST32HFxx42x, and A18 for SST32HFxx82
FIGURE 5: SRAM WRITE CYCLE TIMING DIAGRAM (UBS#, LBS# CONTROLLED)1
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
17
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
TRC ADDRESS AMS-0
TAA
BEF#
TCE
OE# VIH WE# TOLZ
TOE
TOHZ TCHZ HIGH-Z DATA VALID
1253 F06.0
DQ15-0
HIGH-Z
TCLZ
TOH DATA VALID
Note: AMSF = Most Significant Flash Address AMSF = A19 for SST32HF16x2x and A20 for SST32HF32x2x
FIGURE 6: FLASH READ CYCLE TIMING DIAGRAM
INTERNAL PROGRAM OPERATION STARTS TBP ADDRESS AMS-0 5555 TAH TWP WE# TAS OE# TCH BEF# TCS DQ15-0 XXAA SW0 XX55 SW1 XXA0 SW2 DATA WORD (ADDR/DATA) TWPH TDS 2AAA 5555 ADDR TDH
1253 F07.0
Note: AMSF = Most Significant Flash Address AMSF = A19 for SST32HF16x2x and A20 for SST32HF32x2x WP# must be held in proper logic state (VIL or VIH) 1 s prior to and 1 s after the command sequence X can be VIL or VIH, but no other value
FIGURE 7: FLASH WE# CONTROLLED PROGRAM CYCLE TIMING DIAGRAM
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
18
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
INTERNAL PROGRAM OPERATION STARTS TBP ADDRESS AMS-0 5555 TAH TCP BEF# TAS OE# TCH WE# TCS DQ15-0 XXAA SW0 XX55 SW1 XXA0 SW2 DATA WORD (ADDR/DATA) TCPH TDS 2AAA 5555 ADDR TDH
1253 F08.0
Note: AMSF = Most Significant Flash Address AMSF = A19 for SST32HF16x2x and A20 for SST32HF32x2x WP# must be held in proper logic state (VIL or VIH) 1 s prior to and 1 s after the command sequence X can be VIL or VIH, but no other value
FIGURE 8: BEF# CONTROLLED FLASH PROGRAM CYCLE TIMING DIAGRAM
ADDRESSES AMSF-0 TCE BEF# TOEH OE# TOE WE# TOES
DQ7
Data
Data#
Data#
Data
1253 F09.0
Note: AMSF = Most Significant Flash Address AMSF = A19 for SST32HF16x2x and A20 for SST32HF32x2x
FIGURE 9: FLASH DATA# POLLING TIMING DIAGRAM
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
19
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
ADDRESSES AMSF-0 TCE BEF# TOEH OE# TOE TOES
WE#
DQ6 and DQ2
TWO READ CYCLES WITH SAME OUTPUTS
1253 F10.0
Note: AMSF = Most Significant Flash Address AMSF = A19 for SST32HF16x2x and A20 for SST32HF32x2x
FIGURE 10: FLASH TOGGLE BIT TIMING DIAGRAM
SIX-BYTE CODE FOR CHIP-ERASE ADDRESS AMS-0 5555 2AAA 5555 5555 2AAA 5555
TSCE
BEF#
OE# TWP WE#
DQ15-0
XXAA SW0
XX55 SW1
XX80 SW2
XXAA SW3
XX55 SW4
XX10 SW5
1253 F11.0
Note: AMSF = Most Significant Flash Address AMSF = A19 for SST32HF16x2x and A20 for SST32HF32x2x WP# must be held in proper logic state (VIL or VIH) 1 s prior to and 1 s after the command sequence This device also supports BEF# controlled Chip-Erase operation. The WE# and BEF# signals are interchangeable as long as minimum timings are meet. (See Table 14) X can be VIL or VIH, but no other value.
FIGURE 11: WE# CONTROLLED FLASH CHIP-ERASE TIMING DIAGRAM
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
20
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
SIX-BYTE CODE FOR BLOCK-ERASE ADDRESS AMS-0 5555 2AAA 5555 5555 2AAA BAX
TBE
BEF#
OE# TWP WE#
DQ15-0
XXAA SW0
XX55 SW1
XX80 SW2
XXAA SW3
XX55 SW4
XX50 SW5
1253 F13.0
Note: AMSF = Most Significant Flash Address AMSF = A19 for SST32HF16x2x and A20 for SST32HF32x2x This device also supports BEF# controlled Block-Erase operation. The WE# and BEF# signals are interchangeable as long as minimum timings are meet. (See Table 14.) BAX = Block Address WP# must be held in proper logic state (VIL or VIH) 1 s prior to and 1 s after the command sequence X can be VIL or VIH, but no other value.
FIGURE 12: WE# CONTROLLED FLASH BLOCK-ERASE TIMING DIAGRAM
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
21
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
SIX-BYTE CODE FOR SECTOR-ERASE ADDRESS AMS-0 5555 2AAA 5555 5555 2AAA SAX
TSE
BEF#
OE# TWP WE#
DQ15-0
XXAA SW0
XX55 SW1
XX80 SW2
XXAA SW3
XX55 SW4
XX30 SW5
1253 F12.0
Note: AMSF = Most Significant Flash Address AMSF = A19 for SST32HF16x2x and A20 for SST32HF32x2x This device also supports BEF# controlled Sector-Erase operation. The WE# and BEF# signals are interchangeable as long as minimum timings are meet. (See Table 14.) SAX = Sector Address WP# must be held in proper logic state (VIL or VIH) 1 s prior to and 1 s after the command sequence X can be VIL or VIH, but no other value.
FIGURE 13: WE# CONTROLLED FLASH SECTOR-ERASE TIMING DIAGRAM
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
22
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
THREE-WORD SEQUENCE FOR SOFTWARE ID ENTRY ADDRESS A14-0 5555 2AAA 5555 0000 0001
BEF#
OE# TWP WE# TWPH DQ15-0 XXAA SW0 XX55 SW1 XX90 SW2 TAA 00BF MFG ID DEVICE ID
1253 F14.0
TIDA
Note: X can be VIL or VIH, but no other value. Device ID - See Table 3 on page 5
FIGURE 14: SOFTWARE ID ENTRY AND READ
THREE-WORD SEQUENCE FOR SOFTWARE ID EXIT AND RESET
ADDRESS A14-0
5555
2AAA
5555
DQ15-0
XXAA
XX55
XXF0 TIDA
BEF#
OE# TWP WE# TWHP
1253 F15.0
SW0
SW1
SW2
Note: X can be VIL or VIH, but no other value.
FIGURE 15: SOFTWARE ID EXIT AND RESET
(c)2005 Silicon Storage Technology, Inc. S71253-03-000 5/05
23
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
THREE-BYTE SEQUENCE FOR SEC ID ENTRY ADDRESS AMSF-0 5555 2AAA 5555
BEF#
OE# TWP WE# TWPH DQ15-0 XXAA SW0 XX55 SW1 XX88 SW2
1253 F26.0
TIDA
TAA
Note: AMSF = Most Significant Flash Address AMSF = A19 for SST32HF16x2x and A20 for SST32HF32x2x WP# must be held in proper logic state (VIL or VIH) 1 s prior to and 1 s after the command sequence. X can be VIL or VIH, but no other value.
FIGURE 16: FLASH SEC ID ENTRY
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
24
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
RST#
TRP
BEF#/OE# TRHR
1253 F23.0
FIGURE 17: RST# TIMING DIAGRAM (WHEN NO INTERNAL OPERATION IS IN PROGRESS)
TRP RST# TRY BEF#/OE# End-of-Write Detection (Toggle-Bit)
1253 F24.0
FIGURE 18: RST# TIMING DIAGRAM (DURING PROGRAM OR ERASE OPERATION)
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
25
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
VIHT
INPUT
VIT
REFERENCE POINTS
VOT
OUTPUT
VILT
1253 F16.0
AC test inputs are driven at VIHT (0.9 VDD) for a logic "1" and VILT (0.1 VDD) for a logic "0". Measurement reference points for inputs and outputs are VIT (0.5 VDD) and VOT (0.5 VDD). Input rise and fall times (10% 90%) are <5 ns.
Note: VIT - VINPUT Test VOT - VOUTPUT Test VIHT - VINPUT HIGH Test VILT - VINPUT LOW Test
FIGURE 19: AC INPUT/OUTPUT REFERENCE WAVEFORMS
TO TESTER
TO DUT CL
1253 F17.0
FIGURE 20: A TEST LOAD EXAMPLE
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
26
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
Start
Write data: XXAAH Address: 5555H
Write data: XX55H Address: 2AAAH
Write data: XXA0H Address: 5555H
Write Word Address/Word Data
Wait for end of Program (TBP, Data# Polling bit, or Toggle bit operation) Program Completed
1253 F18.0
Note: X can be VIL or VIH, but no other value
FIGURE 21: WORD-PROGRAM ALGORITHM
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
27
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
Internal Timer Program/Erase Initiated
Toggle Bit Program/Erase Initiated
Data# Polling Program/Erase Initiated
Wait TBP, TSCE, or TBE
Read word
Read DQ7
Program/Erase Completed
Read same word
No
Is DQ7 = true data? Yes
No
Does DQ6 match? Yes
Program/Erase Completed
Program/Erase Completed
1253 F19.0
FIGURE 22: WAIT OPTIONS
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
28
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
Sec ID Query Entry Command Sequence
Software Product ID Entry Command Sequence Load data: XXAAH Address: 5555H
Load data: XXAAH Address: 5555H
Load data: XX55H Address: 2AAAH
Load data: XX55H Address: 2AAAH
Load data: XX88H Address: 5555H
Load data: XX90H Address: 5555H
Wait TIDA
Wait TIDA
Read Sec ID
Read Software ID
1253 F20.0
X can be VIL or VIH, but no other value
FIGURE 23: SEC ID/SOFTWARE ID COMMAND FLOWCHARTS
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
29
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
Software ID Exit/Sec ID Exit Command Sequence
Load data: XXAAH Address: 5555H
Load data: XXF0H Address: XXH
Load data: XX55H Address: 2AAAH
Wait TIDA
Load data: XXF0H Address: 5555H
Return to normal operation
Wait TIDA
Return to normal operation
X can be VIL or VIH, but no other value
1253 F25.0
FIGURE 24: SOFTWARE ID/SEC ID COMMAND FLOWCHARTS
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
30
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
Chip-Erase Command Sequence Load data: XXAAH Address: 5555H
Sector-Erase Command Sequence Load data: XXAAH Address: 5555H
Block-Erase Command Sequence Load data: XXAAH Address: 5555H
Load data: XX55H Address: 2AAAH
Load data: XX55H Address: 2AAAH
Load data: XX55H Address: 2AAAH
Load data: XX80H Address: 5555H
Load data: XX80H Address: 5555H
Load data: XX80H Address: 5555H
Load data: XXAAH Address: 5555H
Load data: XXAAH Address: 5555H
Load data: XXAAH Address: 5555H
Load data: XX55H Address: 2AAAH
Load data: XX55H Address: 2AAAH
Load data: XX55H Address: 2AAAH
Load data: XX10H Address: 5555H
Load data: XX30H Address: SAX
Load data: XX50H Address: BAX
Wait TSCE
Wait TSE
Wait TBE
Chip erased to FFFFH
Sector erased to FFFFH
Block erased to FFFFH
1253 F21.0
Note: X can be VIL or VIH, but no other value.
FIGURE 25: ERASE COMMAND SEQUENCE
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
31
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
Concurrent Operation Load SDP Command Sequence
Flash Program/Erase Initiated
Wait for End of Write Indication
Read or Write SRAM
End Wait
Flash Operation Completed
End Concurrent Operation
1253 F22.0
FIGURE 26: CONCURRENT OPERATION FLOWCHART
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
32
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
PRODUCT ORDERING INFORMATION
Device Speed Suffix1 XX Suffix2 XXX X Environmental Attribute E1 = non-Pb Package Modifier FS = 63 ball positions S = 62 ball positions Package Type L = LFBGA (8mm x 10mm x 1.4mm, 0.40mm ball size) Temperature Range C = Commercial = 0C to +70C E = Extended = -20C to +85C Minimum Endurance 4 = 10,000 cycles Read Access Speed 70 = 70 ns Device Blank = PseudoSRAM C = Standard SRAM Hardware Block Protection 2 = Top Boot Block SRAM Density 2 = 2 Mbit 4 = 4 Mbit 8 = 8 Mbit Flash Density 16 = 16 Mbit 32 = 32 Mbit Voltage H = 2.7-3.3V Product Series 32 = MPF+ + SRAM ComboMemory
SST32HFxxxxC - XXX
1. Environmental suffix "E" denotes non-Pb solder. SST non-Pb solder devices are "RoHS Compliant".
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
33
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications Valid combinations for SST32HF1622C SST32HF1622C-70-4C-LS SST32HF1622C-70-4C-LSE SST32HF1622C-70-4E-LS SST32HF1622C-70-4E-LSE SST32HF1622C-70-4C-LFS SST32HF1622C-70-4C-LFSE SST32HF1622C-70-4E-LFS SST32HF1622C-70-4E-LFSE
Valid combinations for SST32HF1642 SST32HF1642-70-4C-LS SST32HF1642-70-4C-LSE SST32HF1642-70-4E-LS SST32HF1642-70-4E-LSE SST32HF1642-70-4C-LFS SST32HF1642-70-4C-LFSE SST32HF1642-70-4E-LFS SST32HF1642-70-4E-LFSE
Valid combinations for SST32HF1642C SST32HF1642C-70-4C-LS SST32HF1642C-70-4C-LSE SST32HF1642C-70-4E-LS SST32HF1642C-70-4E-LSE SST32HF1642C-70-4C-LFS SST32HF1642C-70-4C-LFSE SST32HF1642C-70-4E-LFS SST32HF1642C-70-4E-LFSE
Valid combinations for SST32HF1682 SST32HF1682-70-4C-LS SST32HF1682-70-4C-LSE SST32HF1682-70-4E-LS SST32HF1682-70-4E-LSE SST32HF1682-70-4C-LFS SST32HF1682-70-4C-LFSE SST32HF1682-70-4E-LFS SST32HF1682-70-4E-LFSE
Valid combinations for SST32HF3242 SST32HF3242-70-4C-LS SST32HF3242-70-4C-LSE SST32HF3242-70-4E-LS SST32HF3242-70-4E-LSE SST32HF3242-70-4C-LFS SST32HF3242-70-4C-LFSE SST32HF3242-70-4E-LFS SST32HF3242-70-4E-LFSE
Valid combinations for SST32HF3242C SST32HF3242C-70-4C-LS SST32HF3242C-70-4C-LSE SST32HF3242C-70-4E-LS SST32HF3242C-70-4E-LSE SST32HF3242C-70-4C-LFS SST32HF3242C-70-4C-LFSE SST32HF3242C-70-4E-LFS SST32HF3242C-70-4E-LFSE
Valid combinations for SST32HF3282 SST32HF3282-70-4C-LS SST32HF3282-70-4C-LSE SST32HF3282-70-4E-LS SST32HF3282-70-4E-LSE SST32HF3282-70-4C-LFS SST32HF3282-70-4C-LFSE SST32HF3282-70-4E-LFS SST32HF3282-70-4E-LFSE
Note: Valid combinations are those products in mass production or will be in mass production. Consult your SST sales representative to confirm availability of valid combinations and to determine availability of new combinations.
(c)2005 Silicon Storage Technology, Inc.
S71253-03-000
5/05
34
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications
PACKAGING DIAGRAMS
TOP VIEW
10.00 0.20
BOTTOM VIEW
7.20 0.80
8 7 6 5 4 3 2 1 0.80 ABCDEFGHJK A1 CORNER KJHGFEDCBA 8.00 0.20 5.60
8 7 6 5 4 3 2 1 0.40 0.05 (62X) A1 CORNER
SIDE VIEW
1.30 0.10
1mm
0.12 SEATING PLANE 0.32 0.05
Note:
1. 2. 3. 4.
Although many dimensions are similar to those of JEDEC Publication 95, MO-210, this specific package is not registered. All linear dimensions are in millimeters. Coplanarity: 0.12 mm 62-lfbga-LS-8x10-400mic-4 Ball opening size is 0.32 mm ( 0.05 mm)
62-BALL LOW-PROFILE, FINE-PITCH BALL GRID ARRAY (LFBGA) 8MM X 10MM SST PACKAGE CODE: LS
TOP VIEW
10.0 0.1
BOTTOM VIEW
7.20 0.80
8 7 6 5 4 3 2 1 0.80 ABCDEFGHJK A1 CORNER 1.3 0.1 KJHGFEDCBA 8.0 0.1 5.60
8 7 6 5 4 3 2 1 0.40 0.05 (63X) A1 CORNER
SIDE VIEW
0.12 SEATING PLANE 0.32 0.05
1mm
Note:
1. Although many dimensions are similar to those of JEDEC Publication 95, MO-210, this specific package is not registered. 2. All linear dimensions are in millimeters. 3. Coplanarity: 0.12 mm 4. Ball opening size: 0.32 mm ( 0.05 mm) 63-lfbga-LFS-8x10-400mic-1
63-BALL LOW-PROFILE, FINE-PITCH BALL GRID ARRAY (LFBGA) 8MM X 10MM SST PACKAGE CODE: LFS
(c)2005 Silicon Storage Technology, Inc. S71253-03-000 5/05
35
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282 SST32HF1622C / SST32HF1642C / SST32HF3242C
Preliminary Specifications TABLE 15: REVISION HISTORY
Number 00 01 02 Description Date Feb 2004 Jun 2004 Mar 2005
* * * * * * * * * *
Initial Release Added SST32HF1622C device and associated MPNs Removed SST32HF3282C and SST32HF6482C devices and associated MPNs Changed IDD test condition for frequency specification from 1/TRC Min to 5 MHz See Table 7 on page 12 Added Table 2 on page 5 for the Boot Block address ranges Updated L2S package outline drawing and pin assignments Added RoHS compliance information on page 1 and in the "Product Ordering Information" on page 33 Added the solder reflow temperature to the "Absolute Maximum Stress Ratings" on page 11. Removed all 90 ns information and associated MPNs beginning on page 34 Added all non-Pb MPNs beginning on page 34 Removed SST32HF6482 commercial temperature devices and MPNs Moved SST32HF6482 extended temperature MPNs to S71299 data sheet
03
* *
May 2005
Silicon Storage Technology, Inc. * 1171 Sonora Court * Sunnyvale, CA 94086 * Telephone 408-735-9110 * Fax 408-735-9036 www.SuperFlash.com or www.sst.com
(c)2005 Silicon Storage Technology, Inc. S71253-03-000 5/05
36

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